Earlier today, Samsung announced that it has developed a new memory module standard that may appear on Intel platforms as early as next year. In an industry first, the South Korean giant has developed a low compression memory attached memory module (LPCAMM). Samsung claims this new memory can be more power efficient while performing better than current offerings.

Currently, manufacturers have the option of using two types of memory modules – Low-Power Double Data Rate (LPDDR) DRAM or Small outline Dual In-line Memory Module (So-DIMM). LPDDR is compact but attached to the motherboard, making it ideal for smaller devices such as mobile phones and smart watches. A So-DIMM, on the other hand, is larger but removable, making it great for repair.

Samsung is not the first company to go out of its way to develop a new memory design. Last year, Dell announced that it had developed Memory module attached compression (CAMM) which took care of many of the shortcomings of So-DIMM.

Samsung claims that LPCAMM infuses the patchability of So-DIMM with the compactness of LPDDR, making it a great alternative for all kinds of devices, including smartphones and laptops. Samsung states that LPCAMM takes up to 60% less space while improving performance and power efficiency by up to 50% and 70% respectively. This, combined with the fact that the LPCAMM is removable, makes it an excellent option for all types of hardware.

Samsung’s LPCAMM is built on the DDR5 specification and will come with a Serial Presence Detect (SPD) hub that offers additional features and manages access to an external controller while offloading memory from the internal bus. LPCAMM will also include Power Management Integrated Circuits (PMIC) which will help manage the distribution of power to the various components such as the DRAM register and the SPD hub.

Dr. Dimitrios Ziakas, Vice President of Memory and IO Technology at Intel said:

LPCAMM’s energy efficiency and repairability benefits make this new form factor a game changer in today’s PC market. We are excited to be part of the new standard that enables the client computer ecosystem and pave the way for future adoption and innovation in broader market segments.

Samsung brands the new module as the perfect replacement for all types of hardware. However, the company recognizes the challenges of upgrading to a new standard on a larger scale such as for a server. As such, the company wants to create “significant potential to make it the solution of choice for future data centers and servers.”

Yongcheol Bae, Senior Vice President of the Memory Product Design Team at Samsung Electronics said:

With the growing demand for innovative memory solutions that include high performance, low power consumption and manufacturing flexibility in various fields, LPCAMM is expected to gain widespread adoption in PCs, laptops and data centers. Samsung is committed to actively pursuing opportunities to expand the market for LPCAMM solutions and to work closely with industry to explore new applications for its use.

Samsung plans to test the new LPCAMM modules with new hardware and major customers this year, with the company planning to introduce them to consumers in 2024.